JPH01163390U - - Google Patents
Info
- Publication number
- JPH01163390U JPH01163390U JP5735888U JP5735888U JPH01163390U JP H01163390 U JPH01163390 U JP H01163390U JP 5735888 U JP5735888 U JP 5735888U JP 5735888 U JP5735888 U JP 5735888U JP H01163390 U JPH01163390 U JP H01163390U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat dissipation
- circuit component
- screw holes
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5735888U JPH01163390U (en]) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5735888U JPH01163390U (en]) | 1988-04-30 | 1988-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163390U true JPH01163390U (en]) | 1989-11-14 |
Family
ID=31283215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5735888U Pending JPH01163390U (en]) | 1988-04-30 | 1988-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163390U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115568111A (zh) * | 2022-09-30 | 2023-01-03 | 苏州浪潮智能科技有限公司 | 一种dip器件及用于连接dip器件的pcb板的打孔方法 |
-
1988
- 1988-04-30 JP JP5735888U patent/JPH01163390U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115568111A (zh) * | 2022-09-30 | 2023-01-03 | 苏州浪潮智能科技有限公司 | 一种dip器件及用于连接dip器件的pcb板的打孔方法 |